IPC Standards & Manuals
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IPC-A-600 | £63.00 |
| Also available IPC-A-600 CD | CD £66.00 | |
| and IPC-A-600 hard copy plus CD | CD/PDF £94.00 | |
| The definitive illustrated guide to printed circuit board acceptability! This full-colour document provides photographs and illustrations of the target, acceptable and nonconforming conditions that are either internally or externally observable on bare printed boards. Make sure your operators, inspectors, and engineers have the most current industry consensus information. With over 90 new or revised photographs and illustrations, revision H provides new coverage on topics such as copper wrap plating, copper cap plating of filled holes, and hole wall/barrel separation along with updated and expanded coverage for measling of printed boards, delamination and haloing, laminate voids/cracks, etchback, blind and buried via fill, and flexible circuits. The document sychronizes to the acceptability requirements expressed in IPC-6012 and IPC-6013. 157 pages. Released April 2010. | ||
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IPC-A-610 E | £72.00 |
| Also available IPC-A-610 CD | CD £74.00 | |
| and IPC-A-610 hard copy plus CD | CD/PDF £110.00 | |
| The IEC is in the process of endorsing IPC-A-610 as the globally preferred international acceptance standard for electronics assembly.IPC-A-610 is the most widely used electronics assembly standard in the world. A must for all quality assurance and assembly departments, IPC-A-610E illustrates industry-accepted workmanship criteria for electronics assemblies through full-colour photographs and illustrations. Topics include flex attachment, board in board, part on part, lead free, component orientation and soldering criteria for through-hole, SMT (new termination styles) and discrete wiring assemblies, mechanical assembly, cleaning, marking, coating, and laminate requirements.IPC-A-610 is invaluable for all inspectors, operators and trainers. Revision E has 809 photos and illustrations of acceptability criteria-165 of them new or updated. This revision has been critically reviewed for clarity and accuracy. The document synchronizes to the requirements expressed in other industry consensus documents and is used with the material and process standard IPC J-STD-001. 400 pages. Released April 2010. | ||
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IPC/WHMA-A-620 | £72.00 |
| Also available IPC/WHMA-A-620 CD | CD £74.00 | |
| and IPC/WHMA-A-620 hard copy plus CD | CD/PDF £110.00 | |
| Revision B is now available for the only industry-consensus standard for Requirements and Acceptance of Cable and Wire Harness Assemblies. IPC and the Wire Harness Manufacturers Association (WHMA) teamed to develop this significant update, adding lead free acceptance criteria, a new chapter devoted to electrical and mechanical testing, and enhanced criteria for molding and splicing.This Revision has 599 full-colour pictures and illustrations – nearly 100 new. Readability and usability were improved based on user feedback from the original release. Included in the 19 chapters are criteria for wire prep, soldering to terminals, crimping of stamped and formed contacts and machined contacts, insulation displacement connectors, ultrasonic welding, splicing, connectors, molding, marking, coax/twinax cables, wrapping/lacing, shielding, assembly and wire-wrap terminations. 368 pages. Released July 2006. | ||
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IPC-A-7711/7721 | £100.00 |
| Also available IPC-A-7711/7722 CD | CD £96.00 | |
| and IPC-A-7711/7722 hard copy plus CD | CD/PDF £135.00 | |
| This guide includes everything needed for repair and rework of electronic assemblies and printed circuit boards! IPC-7711B/7721B Rework, Modification and Repair of Electronic Assemblies has received a complete procedure by procedure update to assure applicability to both lead free and traditional SnPb soldered assemblies. This single volume includes all previously published changes and several new procedures for BGAs (including reballing) and flex-print repair. Part 1 General Requirements has also been updated for ease of use and provides important direction and guidelines for all procedures. This section includes procedures common to rework, repair and modification. Part 2 is IPC-7711B and the procedures include tools, materials and methods to be used in removing and replacing surface mount and through-hole components. Part 3 is IPC-7721B and includes procedures for modifying assemblies and accomplishing laminate and conductor repairs. This guide is provided in a three ring binder for easy updating. Users can insert company specific procedures, or remove just the pages needed for a specific job to help keep the workbench clear. Future updates can be downloaded FREE from www.ipc.org/downloads. Many procedures have colour illustrations to help the user understand the guide. Supersedes IPC-7711, IPC-7721 and IPC-R-700. Over 300 pages. Released November 2007. | ||
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J-STD-001E | £60.00 |
| Also available J-STD-001E CD | CD £63.00 | |
| and J-STD-001E hard copy plus CD | CD/PDF £90.00 | |
| J-STD-001E is recognized worldwide as the sole industry-consensus standard covering soldering materials and processes. This revision includes support for lead free manufacturing, in addition to easier to understand criteria for materials, methods and verification for producing quality soldered interconnections and assemblies. The requirements for all three classes of construction are included. Full colour illustrations are provided for clarity. This standard fully complements IPC-A-610E. 54 pages. Released April 2010. | ||
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| J-STD-002 | £40.00 | |
| This standard prescribes test methods, defect definitions, acceptance criteria and illustrations for assessing the solderability of electronic component leads, terminations, solid wires, stranded wires, lugs and tabs. This standard addresses both visual acceptance and force measurement solderability criteria for both tin-lead as well as lead-free solder processes. This standard also includes a test method for the Resistance to Dissolution/Dewetting of Metallization to verify that metallized terminations will remain intact throughout the assembly soldering processes. This standard is intended for use by both vendors and users. The Amendment 1 now included in this IPC/ECA J-STD-002C adds an appendix that defines a test protocol for wetting balance testing and also allows the use of production solder pastes of appropriate lead-based and lead free compositions for surface mount simulation testing. 63 pages. Released November 2008. | ||
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| J-STD-003 | £41.00 | |
| J-STD-003 prescribes test methods, defect definitions and illustrations for assessing the solderability of printed board surface conductors, attachment lands, and plated-through holes utilizing either tin/lead or lead-free solders. This standard is intended for use by both vendor and user. The objective of the solderability test methods described in this standard is to determine the ability of printed board surface conductors, attachment lands, and plated-through holes to wet easily with solder and to withstand the rigors of the printed board assembly processes. This standard describes test methods by which both the surface conductors (and attachment lands) and plated-through holes may be evaluated for solderability. Test A, Test B, Test C, Test D and Test E for tin/lead solder processes and Test A1, Test B1, Test C1, Test D1 and Test E1 for lead-free solder processes, unless otherwise agreed upon between vendor and user. Test A and Test C for tin/lead solder processes, Test A1 and Test C1 for lead-free solder processes are to be used as default solderability tests. 36 pages. Released March 2007. | ||
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| J-STD-004 | £45.00 | |
| This standard prescribes general requirements for the classification and characterization of fluxes for high quality solder interconnections. This standard may be used for quality control and procurement purposes. The purpose of this standard is to classify and characterize tin/lead and lead-free soldering flux materials for use in electronic metallurgical interconnections for printed circuit board assembly. Soldering flux materials include the following: liquid flux, paste flux, solder paste, solder cream, and flux-coated and flux-cored solder wires and preforms. It is not the intent of this standard to exclude any acceptable flux or soldering material; however, these materials must produce the desired electrical and metallurgical interconnection. 20 pages. Released December 2008. | ||
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| J-STD-005 | £35.00 | |
| Lists requirements for qualification and characterization of solder paste. Test methods and criteria for metal content, viscosity, slump, solder ball, tack and wetting of solder pastes are included. Supersedes QQ-S-571. Developed by IPC and EIA. 24 pages. Released January 1995. | ||
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| J-STD-006 | £35.00 | |
This standard prescribes the nomenclature, requirements and test methods for electronic grade solder alloys; for fluxed and non-fluxed bar, ribbon and powder solders for electronic soldering applications; and for ‘‘special’’ electronic grade solders. This is a quality control standard and is not intended to relate directly to the material’s performance in the manufacturing process. Solders for applications other than electronics should be procured using ASTM B-32.This standard is one of a set of three joint industry standards that prescribe the requirements and test methods for soldering materials to be used in the electronics industry. The other two standards in this set are IPC/EIA J-STD-004, Requirements for Soldering Fluxes, and IPC/EIA J-STD-005, Requirements for Soldering Pastes. 29 pages. Released October 2009.Amendments 1 and 2 included in this J-STD-006 modify the following:
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| J-STD-012 | £55.00 | |
| This informative document describes the implementation of flip chip and related chip scale semiconductor packaging technologies. The areas discussed include design considerations, assembly processes, technology choices, application and reliability data. Chip packaging variations include flip chip, HDI, micro BGA, micro SMT and SLICC. Also provides general information on implementing flip chip and chip scale technologies for creating multichip modules, I/C cards, memory cards and very dense surface mount assemblies. Developed by IPC, EIA, MCNC and Sematech. 113 Pages. Released January 1996. | ||
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| J-STD-013 | £55.00 | |
| This document establishes the requirements and interactions necessary for printed board assembly processes for interconnecting high performance/high pin count IC packages. Includes information on design principles, material selection, board fabrication, assembly technology, testing strategy and reliability expectations based on end-use environments. Developed by IPC, EIA, MCNC and Sematech. 96 Pages. Released July 1996. | ||
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| J-STD-020 | £55.00 | |
| Updated with extended support for components used for lead free assembly! This standard identifies the classification levels of nonhermetic solid state surface mount devices that are sensitive to moisture-induced stress. It is used to determine which classification level should be used for initial reliability qualification. These devices can be properly packaged, stored, and handled to avoid subsequent thermal/mechanical damage during solder reflow attachment. Developed by IPC and JEDEC. 14 pages. Released March 2008. | ||
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| J-STD-026 | £55.00 | |
| This standard addresses semiconductor flip chip design requirements. Provides information for using standard semiconductor substrates, materials, assembly and test methods with established fabrication, bumping, test and handling practices. Electrical, thermal and mechanical chip design parameters and methodologies are covered in the standard, as well as the reliability aspects associated with these conditions and processes. The information applies to all new designs as well as modifications of non-flip chip designs. Developed by IPC and EIA. | ||
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| J-STD-027 | £34.00 | |
| This standard establishes mechanical outline requirements for devices supplied in flip chip or Chip Size Package (CSP) formats, including die surface, die terminals, and interconnection balls/bumps/lands to the next level. 13 Pages. Released February 2003. | ||
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| J-STD-028 | £55.00 | |
| This standard establishes construction detail requirements for bumps and other terminal structures used for Flip Chip Scale carriers. The specific standards for different terminations are appropriately matched to a particular interconnection process and include such diverse terminations as solder bumps, columns, non-melting stand-offs and conductive polymer deposits. The document articulates a set of designations and expectations for product performance for the manufacturer and the user of flip chip or chip scale devices. Recommendations are provided to implement the best commercial practices and evolving process improvements. Developed by IPC and EIA. 36 Pages. Released August 1999. | ||
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| J-STD-32 | £55.00 | |
| This standard, developed jointly by IPC and the Electronic Industries Association (EIA) establishes the construction detail requirements for balls and other terminal structures on Ball Grid Array (BGA) packages. It also establishes a set of designations and expectations for product performance. A large variety of terminal structures are recognized for a wide range of applications ranging from highest reliability computer, space and military applications to disposable commodity applications. 10 pages. Released June 2002. | ||
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| J-STD-033 | £35.00 | |
| Provides Surface Mount Device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive SMDs. These methods help avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. By using these procedures, safe and damage-free reflow can be achieved with the dry packing process, providing a minimum shelf life of 12 months from the seal date when using sealed dry bags. Developed by IPC and JEDEC. 17 pages. Released October 2005 | ||
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| J-STD-035 | £35.00 | |
| This test method defines the procedures for performing acoustic microscopy on non-hermetic encapsulated electronic components. It provides users with an acoustic microscopy process flow for detecting defects non-destructively in plastic packages while achieving reproducibility. Developed by IPC and JEDEC. 16 pages. Released April 1999. | ||
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| J-STD-609 | £42.00 | |
| This standard provides a marking and labeling system that aids in assembly, rework, repair and recycling and provides for the identification of:1) those assemblies that are assembled with lead-containing or lead-free solder; 2) components that have lead-containing or lead-free second level interconnect terminal finishes and materials; 3) the maximum component temperature not to be exceeded during assembly or rework processing; 4) the base materials used in the PCB construction, including those PCBs that use halogen-free resin; 5) the surface finish of PCBs; and 6) the conformal coating on PCBAs. New to this revision are additional codes for the more precise specification of certain lead-free solders. 13 pages. Released February 2010. |
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| IPC-1065 | £40.00 | |
| This handbook has been developed to aid printed circuit board (PCB) manufacturers and users in completing Material Declarations that follow the format and guidance of the Joint Industry Material Composition Declaration Guide. It includes information on what a manufacturer should do when a materials declaration request is received; a list of chemical substances likely to be found in a PCB; simplified sample calculations for a material declaration of a PCB; guidelines for determining the composition of an electronic product using analytical techniques. Appendices include a table of chemical lists and laboratory analysis methods; detailed calculation of a material declaration of a PCB; uncertainty of calculated data values; a list of analytical laboratories; a list of relevant documents; and analytical techniques for substances removed from the final version of the joint industry guide. 72 pages. Released January 2005. | ||
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| IPC-2221 | £41.00 | |
| IPC-2221 is the foundation design standard for all documents in the IPC-2220 series. It establishes the generic requirements for the design of printed boards and other forms of component mounting or interconnecting structures, whether single-sided, double-sided or multilayer. Among the many updates to Revision A are new criteria for surface plating, internal and external foil thicknesses, component placement and hole tolerances. Expanded coverage is provided for material properties, dimensioning and tolerancing rules, and via structures as well as updated coupon designs for quality assurance. 112 pages. Released May 2003. | ||
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| IPC-2222 | £41.00 | |
| Used in conjunction with IPC-2221, IPC-2222 establishes the specific requirements for the design of rigid organic printed boards and other forms of component mounting and interconnecting structures. This standard applies to single-sided, double-sided or multi-layered boards. Key concepts in this document are: rigid laminate properties, design requirements for printed board assembly and design requirements for holes/interconnections. Revision A provides new design guidance and requirements for dielectric spacing, lead-free laminate materials, scoring and routing parameters, printed board thickness tolerance, nonfunctional lands, hole aspect ratios and clearance areas in planes. 33 pages. Released December 2010. | ||
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| IPC-2223 | £35.00 | |
| Used in conjunction with IPC-2221, IPC-2223 establishes the requirements for the design of single-sided, double-sided, multilayer, or rigid-flex flexible circuits. Enhancements within Revision B include updated adhesive and adhesiveless constructions, updated coverage for selective plating requirements, new definitions for cover materials, new requirements for the plated-through hole to rigid-flex interface and expanded coverage for nonfunctional lands. 30 pages. Released May 2008. | ||
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| IPC-4101 | £63.00 | |
| This specification covers the requirements for base materials that are referred to as laminate or prepreg. These are to be used primarily for rigid and multilayer printed boards for electrical and electronic circuits. This document contains 66 individual specification sheets that can be searched using key words. These key words allow the document’s user to find materials of a similar nature, but with specific differing properties that fine-tune their laminate and/or prepreg selection needs. This revision’s 11 new specification sheets reflect the expanded offerings for current commercially available laminates and prepregs. These 11 new specification sheets add laminate and prepreg materials to this document that have improved or additional properties that include one or more of the following: low halogen content, lead-free applications, high thermal performance or high speed/high frequency performance. 137 pages. Released August 2009. | ||
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| IPC-6011 | £34.00 | |
| This specification establishes the general requirements and responsibilities for suppliers and users of printed boards. Serving as the foundation for the IPC-6010 Board Performance Documents series, it describes quality and reliability assurance requirements that must be met. For use with IPC-6012 through IPC-6018. Supersedes IPC-RB-276, IPC-SC-320, IPC-TC-500, IPC-ML-950C. 15 pages. Released July 1996. | ||
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| IPC-6012 | £60.00 | |
| This specification covers qualification and performance of rigid printed boards, including single-sided, double-sided, with or without plated-through holes, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surface plating coating requirements, conductors, holes/vias, frequency of acceptance testing and quality conformance as well as electrical, mechanical and environmental requirements. Revision C incorporates many new requirements in areas such as selection for procurement, new surface finishes, hole plating thickness, measling, weave exposure, copper cap plating of filled holes, laminate cracks and voids, etchback, blind and buried via fill, acceptance testing and frequency, and requirements for thermal stress testing. This revision synchronizes to the IPC-A-600H. For use with IPC-6011. Supersedes IPC-6012 with Amendment 1. 52 pages. Released April 2010. | ||
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| IPC-7095 | £66.00 | |
| Also available IPC-7095 hard copy plus CD | £70.00 | |
| Implementing Ball Grid Array (BGA) and Fine-Pitch Ball Grid Array (FBGA) technology presents some unique challenges for design, assembly, inspection and repair personnel. IPC-7095B delivers useful and practical information to anyone currently using BGAs or considering a conversion to area array packaging formats. This has become especially important due to the change in the alloys being used, both on the BGA packages and the solder alloy used to attach it to the printed board land pattern. The major emphasis of Revision B is to provide information to those companies transitioning from the standard tin/lead reflow processes to those that use lead-free materials in the assembly of BGA type components.In addition to providing guidelines for BGA inspection and repair, IPC-7095 also addresses reliability issues and the use of lead-free joint criteria associated with BGAs. There are many new photographs of X-ray or endoscope illustrations to identify some of the characteristics that the industry is experiencing in the implementation of BGA assembly processes as well as void process indicators. 152 pages. Released March 2008. | ||
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| IPC-7351 | £70.00 | |
| IPC-7351 includes both the standard and an IPC-7351 land pattern calculator on CD-ROM for accessing component and land pattern dimensional data.The calculator includes the document’s mathematical algorithms so users can build a land pattern for a corresponding surface mount part quickly and accurately.The tool also allows for modification of dimensional attributes of IPC approved land patterns.This popular document covers land pattern design for all types of passive and active components, including resistors, capacitors, MELFs, SOPs, QFPs, BGAs, QFNs and SONs. The standard provides printed board designers with an intelligent land pattern naming convention, zero component rotations for CAD systems and three separate land pattern geometries for each component that allow the user to select a land pattern based on desired component density.Revision B now includes land pattern design guidance and rules for component families such as resistor array packages, aluminum electrolytic capacitors, column and land grid arrays, flat lead devices (SODFL and SOTFL) and dual flat no-lead (DFN) devices. The revision also discusses the usage of thermal tabs and provides a new padstack naming convention that addresses the shape and dimensions of lands on different layers of printed boards.Purchasers also receive a 30-day trial of the IPC-7351 Land Pattern Wizard developed by Mentor Graphics, which is an advanced version of the IPC-7351 Land Pattern Calculator. The IPC-7351 Land Pattern Wizard tool enables users to not only save their land patterns within new land pattern library files, but also to instantly export land patterns to their preferred CAD format, such as Allegro, Board Station, Expedition, PADS, CADSTAR, OrCAD, Pantheon and P-CAD. 102 pages. Released June 2010. | ||
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| IPC-7912 | £34.00 | |
| Finally – an end to the confusion when calculating defect opportunities for benchmarking! For customers and manufacturers, it seems like every company has a unique way of calculating defects and then reporting on quality. In a complex electronics assembly operation, is it best to calculate using the number of components? The number of leads? What about solder joints? How can companies calculate “best-in-class” with an infinite number of ways of calculating Defects Per Million Opportunities (DPMO)?This is the first revision to the industry’s first consensus document on calculating benchmark indices for defects and quality. The document provides consistent methodologies for calculating benchmark indices for DPMO Index, Component DPMO, Placement DPMO, Termination DPMO, and Overall Manufacturing Index (OMI). This document is for end-of-process benchmarking. Revision A now provides support for unpopulated terminations and has much clearer examples. 12 pages. Released January 2004. | ||
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| DRM-18 | £32.00 | |
| The Component Identification Training & Reference Guide is a valuable tool for employee training and quick reference. This comprehensive component identification resource for electronics assembly operators and inspectors contains colour photographs, computer graphics, schematic symbols and detailed descriptions of more than 50 common through-hole and surface mount components used in electronics assembly today.The new Revision contains updated info on SSOP, TSOP, QFP, LQFP, PQFP, LCC, QFN, and BGA-related packages, including all the variations within those groups.New components include DFN, QFN – Multi Row, PoP (Package on Package), CSP (ChipScale Package), COB (Chip on Board), Bare Die and Flip Chip. Also includes a new section stressing the dangers of cross contamination when using Lead Free components and assemblies.The Terminology Section has quick facts on polarity, orientation, lead styles and Component Reference Designators (CRDs). The “Reading Component Values” section has full-colour, easy-to-use colour code charts for resistors and inductors, as well as charts for reading numbered capacitor data. Contains 73 pages in a compact 5.5 x 8.5 inch (14 x 21.5cm) size. | ||
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| DRM-53 | £32.00 | |
| A learning resource for new hires, operators, sales, purchasing, human resources, administrative personnel, students or anyone interested in understanding the basic processes for both Through-Hole and Surface Mount Assembly. This 32-page, full color, 5 x 8 inch spiral bound Desk Reference Manual explains electronics assembly to the uninitiated. DRM-53 includes over 70 colour photographs and graphic drawings to clearly illustrate assembly technologies in easy to understand terms. Key terms are defined in a glossary — to help simplify the industry lexicon. Also explains how electronics assembly fits into the electronics industry. Each section includes references for additional training and industry specifications that can provide further information. Students can read at their own pace — study the terminology — and see what everything looks like — all from this concise manual. | ||
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| DRM-SMT | £32.00 | |
| Now updated to the latest IPC-A-610 and J-STD-001 – the IPC Training & Reference Guide illustrates critical acceptance criteria for the evaluation of surface mount solder connections.With only 38 pages and a compact 5.5 x 8.5 inch (14 x 21.5 cm) size, these convenient spiral-bound manuals make it easy for your inspectors and operators to make the right solder joint acceptance decisions for all three classes of product.Useful as a training aid in the classroom or on the shop floor, DRM-SMT contains computer generated color illustrations of Chip component, Gull Wing and J-Lead solder joints. Each drawing clearly shows the minimum acceptable condition for each type of component misalignment; and details all of the specifications for minimum/maximum solder joint size, including fillet heights and lengths.DRM-SMT also contains high quality color microphotographs of the major solder defects and conditions such as nonwetting, solder bridging and disturbed joints, including samples of both tin-lead and lead-free solder connections. The appropriate specification/paragraph references from both the IPC-A-610E and J-STD-001E are included for each of the acceptance criteria for further verification. In addition, every change from the D to E revision has been notated to make it easy for your inspectors and operators to learn the new requirements. | ||
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| DRM-WHA-A | £32.00 | |
| Expanded to 59 pages and updated to Revision A of the IPC/WHMA-A-620, this Training & Reference Guide illustrates the critical acceptance criteria for Wire Harness Assembly — all in a convenient and compact 5.5 x 8.5 inch (14 x 21.5 cm) size.DRM-WHA-A explains all the basic acceptance criteria for wire harness assemblers, crimp operators, even QA personnel. This handy reference and training tool is a great way to help explain the most important requirements from the industry standard on Wire Harness Acceptability, IPC/WHMA-A-620. Using easy-to-understand computer-generated graphics and language geared towards the most basic factory-level employees, this guide will help insure that your company products meet the required industry standards.DRM-WHA covers: wire types, gauges, insulation stripping, wire tinning, terminals and contact types, coaxial cables, IPC product categories and acceptance criteria, wire preparation, strand and insulation damage, conductor deformations, open and closed barrel crimp definitions and criteria, crimp deformations, cut-off tabs, punctures, insulation support crimps, inspection windows, bellmouth, conductor crimp requirements, conductor brush, closed barrel crimps, insulation damage, ribbon cable, discrete wire, cup terminals and a glossary of related wire harness terminology. | ||
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| DRM-PTH | £32.00 | |
| Now updated to the latest IPC-A-610 and J-STD-001 – the IPC Training & Reference Guide illustrates critical acceptance criteria for the evaluation of through-hole solder connections.With only 30 pages and a compact 5.5 x 8.5 inch (14 x 21.5 cm) size, these convenient spiral-bound manuals make it easy for your inspectors and operators to make the right solder joint acceptance decisions for all three classes of product.Useful as a training aid in the classroom, or on the shop floor, DRM-PTH-E contains computer generated color illustrations of component, barrel and solder-side perspectives of a plated-through hole. Each drawing clearly shows the minimum acceptable condition for requirements such as land coverage, vertical fill, wetting of lead, land and barrel and contact angle.DRM-PTH also contains high quality color microphotographs of the major solder defects and conditions such as nonwetting, corrosion, projections, fractures, lead protrusion and disturbed joints with pictures of both tin-lead and lead free solder joints. The appropriate specification/paragraph references from both the IPC-A-610E and J-STD-001E are included for each of the acceptance criteria for further verification. | ||
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| HDBK-830 | £59.00 | |
| This handbook is a compilation of the conformal coating industry’s practical experience, and will assist the designers and users of conformal coatings in making informed choices. Users will better understand the properties of the various conformal coatings, the results to be achieved by its application and how to verify that these goals have been met. Use this document as a supplement in conjunction with the industry standard for qualification and quality conformance of conformal coating, IPC-CC-830B. 88 pages. Released October 2002. | ||
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| IPC-T-50 | £55.00 | |
| This essential industry standard provides descriptions and illustrations of electronics interconnect industry terminology to help users and their customers break down language barriers. Revision J contains nearly 400 new or revised terms, including new terminology for chip scale and area array packaging, cable and wire harness technology, assembly processing, moisture sensitive components, and microvia technology. Also includes commonly used industry acronyms. 121 pages. Released 2011. | ||
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| IPC-D-279 | £62.00 | |
| Establishes design concepts, guidelines and procedures for reliable printed wiring assemblies. Focuses on SMT or mixed technology PWAs, specifically addressing the interconnect structure and the solder joint itself. Discusses substrates, components, attachment materials, coatings and assembly processes and testing considerations. In addition, this document contains detailed appendices covering: solder attachments; plated-through via structures; insulation resistance; thermal considerations; environmental stresses; coefficient of thermal expansion; electrostatic discharge; solvents; testability; corrosion aerospace and high altitude concerns. 137 pages. Released July 1996. | ||
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| IPC-CM770 | £48.00 | |
| This revision provides effective guidelines in the preparation and attachment of components for printed circuit board assembly and reviews pertinent design criteria, impacts and issues. It contains techniques for assembly (both manual and machines including SMT, BGA and flip chip) and consideration of, and impact upon, subsequent soldering, cleaning, and coating processes. 150 pages. Revised January 2004. | ||
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| IPC-SM-840 | £40.00 | |
| Establishes the requirements for the evaluation of liquid and dry film solder mask material and for the determination of the acceptability of use on a standard printed board system. IPC-SM-840 provides two classes of requirements, T and H, to re?ect functional performance requirements and testing severity based on industry/end use requirements. Coverage is given to adhesion, material qualification, resistances to solvents, and electrical requirements. Revision E incorporates requirements for flexible cover materials used as a flexible dielectric protective layer over etched conductors and other conductive features.19 pages. Released December 2010. | ||
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| IPC-4202 | £45.00 | |
| This document provides comprehensive data to help users more easily determine both material capability and compatibility for flexible base dielectric materials for manufacture of flexible printed circuitry and flexible flat cables. It includes flexible base material specification sheets that have been updated with the newest properties for the specification material types. It establishes the most current classification system, qualification and quality conformance requirements, including high frequency dielectric properties. 27 pages. Released April 2010. | ||
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| IPC-4203 | £45.00 | |
| Establishes the requirements for adhesive coated dielectric film materials used in the cover sheets and flexible adhesive bonding films of fabricated flexible printed circuitry and flexible flat cable. Provides comprehensive data that will help users more easily determine both material capability and compatibility. IPC-4203 includes adhesive-coated flexible dielectric film material specification sheets which are identified by material type.Closely aligned with IPC-4202 and IPC-4204. Supersedes IPC-FC-232C with Amendment 1 included and, in turn, IPC-FC-232C, IPC-FC-232B, IPC-FC-232A, IPC-FC-232 and IPC-FC-233. 45 pages. Released May 2002. | ||
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| IPC-4204 | £45.00 | |
| Establishes the requirements for metal-clad dielectric film materials used in flexible printed circuitry fabrication and flexible flat cable. Provides comprehensive data that will more easily help users determine both material capability and compatibility. IPC-4204 includes the metal-clad dielectric film material specification sheets which are identified by material type. Closely aligned with IPC-4202 and IPC-4203. Supersedes IPC-FC-241C and, in turn, IPC-FC-241B, IPC-FC-241A and IPC-FC-241. 57 pages. Released May 2002. | ||
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