The StencilQuik™ Difference...It Stays in Place!
Are you frustrated by rework stencil printing? Are you having to perform multiple paste operations due to smeared solder paste or flux patterns? Is miniature stencil cleaning time consuming and frustrating?
We have an answer to your frustrations - StencilQuik™. This breakthrough method allows you to simplify the placement/replacement saving 50% or more of the time required to rework BGAs or CSPs.
Whether you are using paste flux or solder paste StencilQuik™ greatly simplifies your rework process while providing for a more reliableconnection. This method features a unique stay-in place feature which simplifies the placement while increasing the yield of reworked BGAs.
These flexible solder paste stencils remain in place on the site location becoming an integral part of the PCB assembly. StencilQuik™ is manufactured from a polyamide film with a high temperature adhesive covered with a release liner. It is the same type of material you have been using with bar code labels and for protecting gold fingers during the wave soldering process. These stencils are laser cut from high quality, polyamide film with a residue-free high temperature adhesive backing.
The StencilQuik™ apertures correspond to the land patterns on the PCB and define those portions of the PCB which are to have paste or paste flux applied.
See how StencilQuik™ can simplify BGA rework